Thermalle™ CERAMIC Silicone-Free Thermally Conductive Grease (Heatsink Compound)

Thermalle™ CERAMIC Silicone-Free Thermally Conductive Grease is a non-flowing ceramic-filled compound specially designed for high powered CPU’s, heavy heatsinks, and any other demanding cooling applications. It is a non-reactive paste which offers non-electrical, high thermal conductivity and low thermal resistance in a soft, low creep, low bleed consistency. Heat transfer from semiconductor housings to heatsinks increase by over 50% when applied, offering the economical benefit of a longer service life for components.

CERAMIC has low toxicity, is easy to apply, and is compatible across a wide operating temperature range. It is commonly used on diodes, transistors, heatsinks, semiconductors, thermostats, power resistors, and radiators, and is suitable for use in many other applications requiring an increase in heat transfer.