No Clean Flux Gel/Paste

No Clean Flux Gel/Paste (NCFP) is a tacky rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. It can be used for the general touch-up or rework of printed circuit boards, as well as for attaching spheres to ball grid array (BGA) packages.

The superior wetting ability of NCFP results in bright, smooth, and shiny solder joints, whether reflowed by hand, hot-air rework station, convection reflow oven, or vapor phase soldering systems. Residues that remain on surfaces after soldering are clear, leaving a cosmetically appealing repair that can be easily pin probed during in-circuit tests.

No Clean Flux Gel/Paste is compatible with all tin-lead and lead-free alloys and can be applied by brush or cotton swab, dispense needle, pin transfer, or stencil printing. When being used in rework, application should be limited to the area being worked.

NCFP needs to see an SMT style reflow profile to render it fully inactive.