13.56 Mhz RF Induction

Curie Heat Soldering Systems

The Latest High Frequency, RF Technology in Hand Soldering The hand soldering process has changed rapidly over the past ten years, lead free solders were introduced and components are getting smaller and smaller.

These main factors must be put into consideration when looking to upgrade or replace your existing soldering irons.

Gone are the days when you adjust the temperature of your conventional ceramic heating soldering iron to the maximum when you come across difficult solder joint, these higher temperatures burn the flux in solder wire before they have a chance to help the flow of solder which leads to poor solder joint quality, not to mention the drastic reduction of tip life and the chances of tips oxidising and turning black are high.

Fields Of Application:

• Medium & large scale service centres
• R&D Labs for small prototype runs
• Mobile electronics and communications systems devices
• Cellular, PDA s, Handhelds, PC motherboards
• LAN devices, network nodes and military equipment
• Portable medical equipment
• Anything and everything SMD

Components type

• BGA on Flex printed Circuit.

• PTH connectors, card slots and sockets.

• Metal components housing.

• Micro lead frame.

• PBGA with heat sink.

• Processor plastic sockets.

• Processor plastic sockets.

• Metal Shielding.

• CSP and fine pitches BGA.

• Plastic PLCC.

• Through hole sockets.

• Heavy Mass CCGA & CBGA.

• Underfill or epoxy coated components.

• Underfill or epoxy coated components.

• Package over package (POP).

• QFN, VQFN and advanced design QFN.